Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Hardcover)

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture By E-H Wong, Y. -W Mai Cover Image
$225.00

Description


Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

Product Details
ISBN: 9781845695286
ISBN-10: 1845695283
Publisher: Woodhead Publishing
Publication Date: May 22nd, 2015
Pages: 482
Language: English
Series: Woodhead Publishing Series in Electronic and Optical Materials