Test Strategies for 3D Integrated Circuits (Paperback)

Test Strategies for 3D Integrated Circuits By Tanusree Kaibartta Cover Image


Test strategies for 3D integrated circuits refer to the methods and techniques used to ensure that these complex electronic devices are functioning properly. 3D integrated circuits are a type of integrated circuit that uses multiple layers of interconnected components, allowing for higher performance and increased functionality in a smaller form factor.

Testing 3D integrated circuits is a critical step in the manufacturing process, as it helps to identify any defects or malfunctions that could impact the performance or reliability of the device. There are several test strategies that can be used for 3D integrated circuits, including:

Pre-bond testing: This involves testing each layer of the 3D integrated circuit before the layers are bonded together. This can help to identify any defects in individual layers, which can then be addressed before the layers are bonded.

Post-bond testing: Once the layers are bonded together, post-bond testing can be used to verify that the layers are properly connected and that the device is functioning as expected.

Through-silicon-via (TSV) testing: TSVs are vertical connections that allow for communication between the different layers of the 3D integrated circuit. Testing these connections is critical to ensure that the device is functioning properly.

Thermal testing: 3D integrated circuits can generate a significant amount of heat, which can impact their performance and reliability. Thermal testing can help to identify any issues related to heat dissipation and ensure that the device is functioning within safe temperature ranges.

Functional testing: Finally, functional testing is used to verify that the 3D integrated circuit is performing as expected and meeting its design requirements. This may involve testing the device under a range of operating conditions to ensure that it is able to perform its intended function.

Overall, effective test strategies are critical to ensuring the quality and reliability of 3D integrated circuits, which are increasingly important in a wide range of electronic devices, including smartphones, computers, and IoT devices.

Product Details
ISBN: 9781805258780
ISBN-10: 1805258788
Publisher: Tanusree Kaibartta
Publication Date: April 17th, 2023
Pages: 194
Language: English